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Informe

Producto: ThermalRight XP-90 Copper
Autor: RockeT

07/05/05

Agradezco a OCWAR el haberme facilitado este producto para probarlo. 

 

  • Características

  • All copper design for maximum performance
  • Multiple heatpipes for well spread heat around copper fins
  • Soldered fins to copper base to make effective contact
  • Compatibility across multiple platforms (socket 478/754/775/939/940)
  • Enormous wingspan gives extra cooling to MOSFET or NB chipset

    Technical Spec.:

    Dimension:

    L116 x W96 x H75 (mm) Fin only, without fan
    L116 x W96 x H96 (mm) Fin only, with 25mm thick fan
     

     

    Weight:

    690g (heat sink only)

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